Your competent partner with ultimate focus & competence in vacuum and vacuum related technologies. Scitek offers solutions from industrial production to scientific ultra high vacuum pumps. Our portfolio includes world leading brands such as Pfeiffer Vacuum, Adixen, Gamma, VAT, Cambride Nanotech, Semicore, MBraun and many more.
Scitek provides a wide range of Thin Film Deposition products used to built or optimize product design across a wide array of applications. Applications range from an increased production rate of silicon chips to increased adhesion strength and reproducibility, making it ideal for research labs and large quantity manufacturing environments.
Kurt J. Lesker
Physical Vapor Deposition Systems
Physical vapor deposition (PVD) systems deposit thin films and coatings by a process in which a target material is vaporized, transported, and condensed on to a substrate. PVD processes include Sputtering, Electron beam, and Thermal Evaporation.
PRO Line PVD Series – Versatile Sputtering, Electron Beam, Thermal, & Organic Evaporation Deposition Platform
The PRO Line PVD Series utilizes a modular design configurable for a variety of thin film deposition applications.
Available in three increasing chamber sizes: PVD75, PVD200, and PVD500
Available with TORUS® Mag Keeper™ UHV Compatible Circular Magnetron Sputtering Sources in 2", 3", 4" diameters
Available with TORUS® Linear Magnetrons
Available with Multi-pocket electron beam evaporation sources
Available with multiple thermal evaporation source configurations
Up to two organic evaporation sources available
Multi-technique options available. Examples: Electron beam + Sputtering, Electron beam + evaporation
Wet or dry rough pumping, turbo pump, or cryogenic pump high vacuum pumping options available
Standard configurations compatible with up to 11" to 20" OD substrates (pending chamber size); up to 850°C heating, cooling, and biasing options available
Single and multi-wafer load lock options available for substrates up to 6"
PRO Line series of PVD tools include KJLC's innovative eKLipse™ advanced control package
SPECTROS™ Series – Organic Thin Film Deposition & Metallization Platform
Available in three increasing chamber sizes: Mini SPECTROS, SPECTROS 150, and Super SPECTROS 200
Incorporates a sliding front door with glove box interface flange and hinged rear door for unobstructed chamber access.
Available with multiple 1cc, 10cc, or 35cc plug-in low-temperature organic sources and thermal evaporation sources. The Mini can accommodate up to two TORUS® Mag Keeper™ Circular Magnetron Sputtering Sources. The SPECTROS can accommodate a multi-pocket electron-beam evaporation source. Multi-technique options available.
Scroll type rough pumping; turbo and cryogenic high vacuum pumping options.
Standard configurations compatible with 4" x 4" (100mm x 100mm) up to 8" x 8" (200mm x 200mm) square substrates (pending chamber size), up to 350°C heating, glove box, up to 5 mask storage shelves with motorized transfer, and wedge tool options.
Single and multi-wafer load lock options available for substrates up to 8" x 8" (200mm x 200mm).
Recipe driven computer system include KJLC's innovative eKLipse™ advanced control package.
The LAB Line series of platforms is purpose built to optimize performance in UHV magnetron sputtering applications.
Comprised of 2 standard platforms (LAB Line SPUTTER 5 and LAB Line Sputter 12) with various system options.
LAB Line SPUTTER 5 features up to 5 MagKeeper UHV magnetron sputtering sources in a confocal arrangement.
LAB Line SPUTTER 12 features up to 12 MagKeeper UHV magnetron sputtering sources in a confocal arrangement.
Both LAB Line SPUTTER 5 and LAB Line SPUTTER 12 are fully bakeable to achieve UHV pressures.
Turbo or cryogenic high vacuum pumping are options available, both with dry rough pumping.
Standard configurations compatible with up to 150mm O.D. substrates; custom substrate configurations available, up to 1000°C heating, cooling, and biasing options available.
Standard configuration supports single wafer load lock, customized options available.
LAB Line series of PVD tools include KJLC's innovative eKLipse advanced control package.
KJLC's most affordable deposition system platform, designed specifically for seamless glovebox integration.
Typically used in the university and government lab R&D environment.
Magnetron Sputtering or thermal evaporation deposition techniques available. For thermal evaporation, this includes the option to select our Low Temperature Evaporator (LTE) sources that are terrific for depositing volatile organic materials.
Up to 3 TORUS® Mag Keeper™ Magnetron sputtering sources or up to 4 thermal evaporation sources available.
Wet or dry rough pumping options available.
Standard configurations compatible with up to 6" substrates, with substrate heating and cooling options available.
This system comes standard with our full suite of KJLC® eKLipse™ Control Software.
Atomic Layer Deposition Systems
KJLC® currently offers two state-of-the-art systems for Atomic Layer Deposition (ALD): the ALD150LX™ and the ALD150LE™. As substrate features continue to decrease in size while increasing in complexity, ALD techniques will become increasingly important to meet the strict demands for conformal, pristine, high quality thin films and their interfaces. Both of these systems are ideally suited to meet even the most demanding challenges associated with next generation 3D nanotechnology.
Their ALD platform features high quality, compact designs that provide extreme flexibility while maintaining system component accessibility and serviceability. All system components meet the highest of quality standards, including parts manufactured in-house by our Manufacturing Division.
Perpendicular flow, showerhead design for uniform precursor dispersion & delivery
Up to 150 mm diameter substrates with an independent substrate heater stage capable of 500°C operation
Accommodates up to ten precursor sources with two separate chamber inlets
Variety of precursor delivery options are available including vapor draw, flow-through & pulsed gas delivery
Precursor exposure modes include dynamic, static & Variable Residence Mode™
Unparalleled temperature control and uniformity of heated system components
Ozone source
Glovebox connectivity
True precision ALD valve timing
KJLC® eKLipse™ system control software for the most demanding process requirements
Low maintenance, easy to service reactor design
Cluster & Custom Deposition Systems
A cluster tool utilizes a central robotic distribution chamber to connect multiple process (PVD, ALD) and metrology chambers while enabling substrate transfer under vacuum. A custom system is designed to meet your specific needs for a vacuum process solution.
KJLC's automated cluster tool system platform, designed specifically with the high-level researcher in mind.
Incorporates a central robotic sample transfer system enabling connection of up to 10 process modules.
Multi-chamber capability for device fabrication, thin film deposition and analysis, GMR magnetic films R&D/production, and organic displays, lighting or electronics.
Magnetron sputtering, thermal evaporation, electron beam evaporation, organic materials evaporation, and atomic layer deposition techniques available.
Standard configurations compatible with up to 8" x 8" (200mm x 200mm) square substrates; sample heating, cooling, bias, and cleaning options available.
Simple single chamber bell jar systems for smaller R&D applications to complex multi-chamber computer-controlled cluster tool systems for OLED/PLED production, and everything in-between
Magnetron sputtering (RF, DC, and Pulsed DC) sources in both linear and circular configurations
ISO Flux, hollow-cathode magnetron sputtering systems for advanced coatings on 3D substrates, or off-axis sputtering
Electron beam evaporation
Thermal evaporation for metals and organics
Pulsed Filtered Cathodic Arc Source systems
Ion sources for substrate cleaning and assisted deposition
HV or UHV vacuum systems
GMR and OLED/PLED R&D and device fabrication systems
Industrial box coaters and space simulation systems
Classic Deposition Systems
Platforms that are specially engineered to meet a customer's requirements.
The AXXIS platform incorporates radial deposition ports and a right-angled tilting substrate stage to efficiently facilitate multiple deposition techniques.
Substrate stage allows precise angled resolution for applications, such as Glancing Angle Deposition.
Up to 6 HV magnetron sputtering sources, multi-pocket electron beam evaporation source, up to 3 thermal evaporation sources (multi-technique options available).
Wet or dry rough pumping, turbo, magnetically-levitated turbo or cryogenic pump high vacuum pumping options available.
Standard configurations compatible with up to 8" OD substrates; custom configurations available, up to 550°C heating, cooling, and glow discharge options available.
Single or multi-wafer load lock option available.
Basic computer system control with recipe and data logging options available.
PVD-DRUM
The PVD-DRUM platform combines a drum fixture with linear cathodes to provide a high throughput, high uniformity system.
The vertical, cylindrical drum houses multiple wafers that are rotated through the linear cathodes deposition plume.
Linear cathodes provide a very uniform coating over a large area to provide a typical deposition uniformity of better than +/-5%.
These system utilize the standard PVD 75, PVD 200 and PVD 500 platform chambers and components.
KJLC's newest array of deposition system platforms, designed specifically for use with Isoflux hollow cathode magnetron sputtering sources.
Typically used in both R&D and production applications.
Magnetron sputtering deposition techniques.
Purpose-built for hollow cathode sputtering sources, yet based on existing, proven KJLC system platforms.
Wet or dry rough pumping, diffusion or turbo pump high vacuum pumping options available.
Simple PLC-based touch screen system control and full computer controlled automation available.
Pulsed Filtered Cathodic Arc
System tools utilizing the innovative Pulsed Filtered Cathodic Arc Source technology.
Highly efficient for hard coatings and diamond like carbon coatings.
Arc systems allow a high level of film property control, such as tuning the films compressive stress.
Arc systems operate at a lower pressure than traditional sputtering tools.
These system utilize the standard PVD 75, PVD 200 and PVD 500 platform chambers and components.
MBE (Omicron Scienta)
EVO-25/50 –The EVO-25/50 MBE-Systems are dedicated growth systems with a loadlock chamber and with an optional preparation/storage chamber. The substrate sizes are either 1” (EVO-25) or 2” (EVO-50). The systems of course also accept the Omicron standard sample plates.
The carefully designed chamber with up to 10 effusion cells shows excellent thickness uniformity for all substrate sizes. The large effusion cell capacity of to 80 cm3 for layer growth increases the up-time of the system significantly.
The fast & reliable sample transfer together with the excellent performance results in a low cost of ownership. The optional available easy & intuitive to operate growth control software and the possibility to add standard Omicron analysis equipment makes this a unique MBE system for researchers.
LAB-10 – The LAB-10 MBE System is the standard MBE system with a loadlock chamber and with an optional preparation/storage chamber. The substrate size for the LAB-10 MBE system is the Omicron standard sample plate.
Its proven chamber design with up to 7 effusion cells is revealed in an excellent thickness homogeneity for a 10 mm substrate. The effusion cell capacity can range from 10 cm3 up to 35 cm3 for layer growth.
The fast & reliable sample transfer together with the excellent performance results in a low cost of ownership. The optional available easy & intuitive to operate growth control software and the possibility to add standard Omicron analysis equipment makes this a unique MBE system for researchers.
PRO-75/100 – The PRO-75/100 MBE-Systems are dedicated growth systems with a loadlock chamber and with an optional preparation/storage chamber. The substrate sizes are either 3” (PRO-75) or 4” (PRO-100). The systems of course also accept smaller samples (1” and 2”) and the Omicron standard sample plates.
The carefully designed chamber with up to 12 effusion cells shows excellent thickness uniformity for all substrate sizes. The large effusion cell capacity of to 130 cm3 for layer growth increases the up-time of the system significantly. The fast & reliable sample transfer together with the excellent performance results in a low cost of ownership. The optional available easy & intuitive to operate growth control software and the possibility to add standard Omicron analysis equipment makes this a unique MBE system for researchers.
PECVD (Sentech)
ICP Plasma Deposition System– The high end ICPECVD system SI 500 D provides exceptional performance for plasma based deposition processes. High quality dielectric and Si films are deposited using high density PECVD generated with the PTSA ICP plasma source. The planar triple spiral antenna (PTSA) ensures excellent properties of the deposited films, such as low etching rates, low stress and low interface state density at very low deposition temperatures (≤ 100 °C)
PECVD Loadlock System– The flexible PECVD system SI 500 PPD features a variety of standard plasma deposition processes. SiO2, SiNx, SiOxNy, and a-Si are deposited with capacitively coupled plasma. The flexible design allows to use gaseous or liquid precursors for PECVD like TEOS.
PECVD Direct Loading System– The PECVD system Depolab 200 combines cost effective direct loading and parallel plate plasma source in a basic, compact design. The easy to use direct loading system enables user-friendly batch processing (with carrier or direct loading onto the substrate electrode). The clever PECVD system can be upgraded for enhanced performance on demand.
Atomic Layer Deposition Systems (ALD)
Plasma Enhanced ALD - The true remote CCP source ensures lowest impact to the substrate (no ions, no light from plasma) and guarantees stable pulse operation during the plasma-enhanced atomic layer deposition (PEALD) process.
In-situ Diagnostic - The system can be equipped with several in-situ diagnostics tools e. g. QCM, QMS, ellipsometer. Ultra-fast in-situ ellipsometers are offered for monitoring layer-by-layer film growth applying laser ellipsometry as well as wide range spectroscopic ellipsometry.
Atomic Layer Deposition (ALD) is a layer-by-layer deposition process of very thin films with conformal coating on 3D structures. Precise control of thickness and film properties is facilitated by adding precursors in separate steps into the vacuum chamber during process cycle. Plasma Enhanced Atomic Layer Deposition (PEALD) is an advanced method of extending the capabilities of ALD by applying radical gas species rather than water as oxidizer during the deposition process.
Advanced Pulsed Laser Deposition (PLD) with in situ RHEED – PDF Thin film growth with atomic precision – TSST Advanced Pulsed Deposition systems with in situ RHEED are state-of-the-art, highly flexible PLD systems for thin film research at atomic level, ideally suited and field proven for research on a large variety of materials including complex oxides.
Thin film growth of highest quality complex materials
Single monolayer growth control with RHEED
Fully customised design, including adaptation to a specific lab layout
Remote support, service and on site training by TSST engineers
Down to 5.0 x 10-10 mbar base pressure
Up to 1200C growth temperature
Up to 6 odd shaped targets for heterostructure growth
Pulsed Laser Deposition (PLD) for thin film growth – PDF Thin film growth of highest quality oxides and nitrides – TSST Pulsed Laser Deposition systems for thin film growth are state-of-the-art, highly flexible PLD systems for thin film research, ideally suited and field proven for research on a large variety of materials including complex oxides.
Thin film growth of highest quality complex materials
Fully customized design, including adaptation to a specific lab layout
Remote support, service and on site training by TSST engineers
